As smartphones and tablets become more popular and more advanced, they drive the rapid development of progressively better and cheaper inertial sensors, and we’ve come to expect a new 3D compass/accelerometer chip from ST every year or so. We’re catching up again with their latest technology (for the time being) with the release of our LSM303D 3D compass and accelerometer carrier.
The LSM303D offers a number of improvements over its predecessors, including a wider maximum magnetic sensing range (up to ±12 gauss). It also features a more unified I²C interface and adds support for SPI communication. Our carrier board includes a 3.3 V voltage regulator and level shifters that make it easy to use with 5 V systems. For more information, see the product page.
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